56-1508-20
- Manufacturer
- Aries Electronics, Inc.
- Product Category
- Sockets for ICs, Transistors
- Description
- CONN IC DIP SOCKET 56POS GOLD
- Manufacturer :
- Aries Electronics, Inc.
- Product Category :
- Sockets for ICs, Transistors
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Tin
- Contact Finish Thickness - Mating :
- 10.0µin (0.25µm)
- Contact Finish Thickness - Post :
- 200.0µin (5.08µm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Brass
- Features :
- Closed Frame
- Housing Material :
- Polyamide (PA46), Nylon 4/6
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 56 (2 x 28)
- Operating Temperature :
- -55°C ~ 105°C
- Packaging :
- Bulk
- Part Status :
- Active
- Pitch - Mating :
- 0.100" (2.54mm)
- Pitch - Post :
- 0.100" (2.54mm)
- Series :
- 508
- Termination :
- Wire Wrap
- Type :
- DIP, 0.2" (5.08mm) Row Spacing
- Datasheet :
- 56-1508-20
Manufacturer related products
Catalog related products
related products
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| 56-1 | Bel Corporation | 5 | XFRMR LAMINATED 56VA CHAS MOUNT |
| 56-100-LPI | Bel Corporation | 5,000 | XFRMR SEMI-TORO 6VA THRU HOLE |
| 56-12 | Bel Corporation | 5,000 | XFRMR LAMINATED 672VA CHAS MOUNT |
| 56-160-LPI | Bel Corporation | 50 | XFRMR SEMI-TORO 9VA THRU HOLE |
| 56-184M65 | Aries Electronics, Inc. | 5,000 | SOCKET ADAPTER QFP TO 184PGA |
