- Manufacturer：
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- CUI Devices (39)
- Parker Chomerics (4)
- t-Global Technology (73)
- Series：
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- Type：
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- Shape：
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- Thickness：
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- Thermal Conductivity：
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- Outline：
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- Backing, Carrier：
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- Thermal Resistivity：
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132 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Laird Thermal Materials | TFLEX SF8120 |
5,000
In-stock
|
Get Quote | ||
|
|
t-Global Technology | THERM PAD 320MMX320... |
5,000
In-stock
|
Get Quote | ||
|
|
Laird Thermal Materials | TFLEX SF8110 |
5,000
In-stock
|
Get Quote | ||
|
|
t-Global Technology | THERM PAD 300MMX300... |
5,000
In-stock
|
Get Quote | ||
|
|
Laird Thermal Materials | TFLEX SF8100 |
5,000
In-stock
|
Get Quote | ||
|
|
t-Global Technology | THERM PAD 300MMX300... |
5,000
In-stock
|
Get Quote | ||
|
|
Laird Thermal Materials | TFLEX SF890 |
5,000
In-stock
|
Get Quote | ||
|
|
Laird Thermal Materials | TFLEX SF880 |
5,000
In-stock
|
Get Quote | ||
|
|
t-Global Technology | THERM PAD 320MMX320... |
5,000
In-stock
|
Get Quote | ||
|
|
Laird Thermal Materials | TFLEX SF870 |
5,000
In-stock
|
Get Quote | ||
|
|
t-Global Technology | THERM PAD 300MMX300... |
5,000
In-stock
|
Get Quote | ||
|
|
t-Global Technology | THERM PAD 100MMX100... |
5,000
In-stock
|
Get Quote | ||
|
|
t-Global Technology | THERM PAD 100MMX100... |
5,000
In-stock
|
Get Quote | ||
|
|
t-Global Technology | THERM PAD 300MMX300... |
5,000
In-stock
|
Get Quote | ||
|
|
Laird Thermal Materials | TFLEX SF860 |
5,000
In-stock
|
Get Quote | ||
|
|
Laird Thermal Materials | TFLEX SF850 |
5,000
In-stock
|
Get Quote | ||
|
|
t-Global Technology | THERM PAD 320MMX320... |
5,000
In-stock
|
Get Quote | ||
|
|
Laird Thermal Materials | TFLEX SF840 |
5,000
In-stock
|
Get Quote | ||
|
|
t-Global Technology | THERM PAD 300MMX300... |
5,000
In-stock
|
Get Quote | ||
|
|
t-Global Technology | THERM PAD 300MMX300... |
5,000
In-stock
|
Get Quote |
