- Manufacturer：
-
- Aavid (42)
- Comair Rotron (7)
- CUI Devices (12)
- Ohmite (1)
- Wakefield-Vette (13)
- Series：
-
- Part Status：
-
- Material：
-
- Packaging：
-
- Type：
-
- Shape：
-
- Length：
-
- Package Cooled：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
123 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BL... |
1,745
In-stock
|
Get Quote | ||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
1,188
In-stock
|
Get Quote | ||
|
|
Aavid | HEATSINK TO-220 SO... |
230
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | HEATSINK TO-220 W/P... |
6,279
In-stock
|
Get Quote | ||
|
|
Aavid | HEATSINK W/TAB BL... |
2,592
In-stock
|
Get Quote | ||
|
|
Aavid | HEATSINK TO-220 W/T... |
3,357
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.7W... |
864
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.7W... |
964
In-stock
|
Get Quote | ||
|
|
CTS Electronic Components | HEATSINK CLIP ON... |
512
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
879
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
879
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
750
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BL... |
595
In-stock
|
Get Quote | ||
|
|
Assmann WSW Components | HEATSINK TO-263 19.3... |
393
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.6W... |
327
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 VE... |
860
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.2W... |
734
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.2W... |
884
In-stock
|
Get Quote | ||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
565
In-stock
|
Get Quote |
