- Manufacturer:
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- CUI Devices (1)
- Material:
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- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK ALUM AN... |
755
In-stock
|
Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUS... |
794
In-stock
|
Get Quote | ||
|
Assmann WSW Components | HEATSINK ALUM AN... |
7,556
In-stock
|
Get Quote |
















