- Manufacturer：
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- CUI Devices (1)
- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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5 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK CPU W/AD... |
5,000
In-stock
|
Get Quote | ||
|
|
Assmann WSW Components | HEATSINK CPU W/AD... |
5,000
In-stock
|
Get Quote | ||
|
|
Assmann WSW Components | HEATSINK CPU STA... |
2,250
In-stock
|
Get Quote | ||
|
|
Assmann WSW Components | HEATSINK CPU STA... |
2,250
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
794
In-stock
|
Get Quote |
