Material:
Package Cooled:
Attachment Method:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Material Finish:
Image Part Manufacturer Description Stock Action
HS24 Apex Microtechnology
HEATSINK SMT
RFQ
86
In-stock
Get Quote
HS01 Apex Microtechnology
HEATSINK TOP MT T...
RFQ
1,149
In-stock
Get Quote
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