- Manufacturer：
-
- Maxim Integrated (3)
- 3M (1)
- Amphenol ICC (6)
- C&K (3)
- JAE Electronics (5)
- TE Connectivity (12)
- Würth Elektronik (8)
- Series：
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- Mounting Type：
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- Features：
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- Height Above Board：
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- Connector Type：
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- Number of Positions：
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- Contact Finish：
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- Contact Finish Thickness：
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- Card Type：
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- Mounting Feature：
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- Insertion, Removal Method：
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60 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Würth Elektronik | CONN COMPACT FLA... |
5,000
In-stock
|
Get Quote | ||
|
|
Würth Elektronik | CONN COMPACT FLA... |
5,000
In-stock
|
Get Quote | ||
|
|
3M | CONN COMPACT FLA... |
5,000
In-stock
|
Get Quote | ||
|
|
KYOCERA Corporation | CONN SD CARD PUSH... |
5,000
In-stock
|
Get Quote | ||
|
|
KYOCERA Corporation | CONN SD CARD PUSH... |
5,000
In-stock
|
Get Quote | ||
|
|
JAE Electronics | CONN SIM CARD HIN... |
5,000
In-stock
|
Get Quote | ||
|
|
JAE Electronics | CONN SIM CARD HIN... |
5,000
In-stock
|
Get Quote | ||
|
|
JAE Electronics | CONN SIM CARD HIN... |
5,000
In-stock
|
Get Quote | ||
|
|
Hirose Electric Co Ltd | CONN MICRO SD CAR... |
5,000
In-stock
|
Get Quote | ||
|
|
- | CONN SIM CARD PUS... |
5,000
In-stock
|
Get Quote | ||
|
|
ITT Interconnect Solutions | CONN COMPACT FLA... |
5,000
In-stock
|
Get Quote | ||
|
|
ITT Interconnect Solutions | CONN COMPACT FLA... |
5,000
In-stock
|
Get Quote | ||
|
|
ITT Interconnect Solutions | CONN COMPACT FLA... |
5,000
In-stock
|
Get Quote | ||
|
|
ITT Interconnect Solutions | CONN COMPACT FLA... |
5,000
In-stock
|
Get Quote | ||
|
|
Molex Corporation | MSD/MSIM COMBO 2.1... |
22
In-stock
|
Get Quote | ||
|
|
Molex Corporation | MSD/MSIM COMBO 2.1... |
22
In-stock
|
Get Quote | ||
|
|
Molex Corporation | MSD/MSIM COMBO 2.1... |
5,000
In-stock
|
Get Quote | ||
|
|
JAE Electronics | CONN MICRO SIM CA... |
5,000
In-stock
|
Get Quote | ||
|
|
JAE Electronics | CONN MICRO SIM CA... |
5,000
In-stock
|
Get Quote | ||
|
|
TE Connectivity | CONN SIM CARD PUS... |
5,000
In-stock
|
Get Quote |
