- Manufacturer：
-
- CUI Devices (39)
- Parker Chomerics (3)
- Color：
-
- Shape：
-
- Thickness：
-
- Thermal Conductivity：
-
- Outline：
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- Backing, Carrier：
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- Thermal Resistivity：
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58 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Laird Thermal Materials | TFLEX SF8120 |
5,000
In-stock
|
Get Quote | ||
|
|
Laird Thermal Materials | TFLEX SF8110 |
5,000
In-stock
|
Get Quote | ||
|
|
Laird Thermal Materials | TFLEX SF8100 |
5,000
In-stock
|
Get Quote | ||
|
|
Laird Thermal Materials | TFLEX SF890 |
5,000
In-stock
|
Get Quote | ||
|
|
Laird Thermal Materials | TFLEX SF880 |
5,000
In-stock
|
Get Quote | ||
|
|
Laird Thermal Materials | TFLEX SF870 |
5,000
In-stock
|
Get Quote | ||
|
|
Laird Thermal Materials | TFLEX SF860 |
5,000
In-stock
|
Get Quote | ||
|
|
Laird Thermal Materials | TFLEX SF850 |
5,000
In-stock
|
Get Quote | ||
|
|
Laird Thermal Materials | TFLEX SF840 |
5,000
In-stock
|
Get Quote | ||
|
|
Laird Thermal Materials | TFLEX SF830 |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | THERM PAD 26.25MMX5... |
5
In-stock
|
Get Quote | ||
|
|
CUI Devices | THERM PAD 20MMX40M... |
4
In-stock
|
Get Quote | ||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | THERM PAD 30MMX31.2... |
4
In-stock
|
Get Quote | ||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | THERMAL INTERFAC... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | THERM PAD 20MMX20M... |
11
In-stock
|
Get Quote | ||
|
|
CUI Devices | THERM PAD 70MMX70M... |
13
In-stock
|
Get Quote | ||
|
|
CUI Devices | THERM PAD 15MMX30M... |
11
In-stock
|
Get Quote |
