Package Cooled:
Attachment Method:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Image Part Manufacturer Description Stock Action
902-21-2-23-2-B-0 Wakefield-Vette
HEATSINK 21X21X23MM...
RFQ
249
In-stock
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HS01 Apex Microtechnology
HEATSINK TOP MT T...
RFQ
1,149
In-stock
Get Quote
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