- Manufacturer：
-
- Comair Rotron (3)
- CUI Devices (2)
- Ohmite (4)
- Part Status：
-
- Material：
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- Length：
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- Width：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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15 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK EXTRUDE... |
5,000
In-stock
|
Get Quote | ||
|
|
Comair Rotron | HEATSINK EXTRUDE... |
5,000
In-stock
|
Get Quote | ||
|
|
Comair Rotron | HEATSINK EXTRUDE... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
Get Quote | ||
|
|
Apex Microtechnology | HEATSINK 12P PWR S... |
22
In-stock
|
Get Quote | ||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
256
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 35MM X 46... |
728
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 50MM X 45... |
5,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 35MM X 46... |
80
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 50MM X 45... |
48
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK DUAL FO... |
23
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
194
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK AND CLI... |
1,341
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK W/CLIP F... |
557
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK AND CLI... |
994
In-stock
|
Get Quote |
