- Manufacturer：
-
- CUI Devices (1)
- Ohmite (4)
- Package Cooled：
-
- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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6 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 4.4W... |
5,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 AL... |
1,338
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK TO-218,TO... |
1,424
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK TO-218,TO... |
1,303
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK TO-218,TO... |
4,836
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK TO-220,TO... |
2,706
In-stock
|
Get Quote |
