- Manufacturer：
-
- CUI Devices (5)
- Packaging：
-
- Type：
-
- Width：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
10 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK TO-263 CO... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-252 CO... |
5,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
219
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
219
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
5,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-252 D-P... |
559
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
879
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
879
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
750
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
2,660
In-stock
|
Get Quote |
