- Manufacturer：
-
- Aavid (42)
- CUI Devices (5)
- Wakefield-Vette (4)
- Material：
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- Packaging：
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- Length：
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- Width：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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80 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 CO... |
5,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
Get Quote | ||
|
|
Assmann WSW Components | HEATSINK TIN SOL... |
75
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
5,000
In-stock
|
Get Quote | ||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
5,000
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | HEATSINK ALUM NA... |
5,000
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | HEATSINK ALUM BL... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-252 CO... |
5,000
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | BOARD LEVEL HEAT... |
5,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
Get Quote |
