- Manufacturer：
-
- Aavid (5)
- CUI Devices (3)
- Ohmite (14)
- Wakefield-Vette (4)
- Material：
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- Length：
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- Width：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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29 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Ohmite | TO-268 SMD HEAT SIN... |
5,000
In-stock
|
Get Quote | ||
|
|
Ohmite | TO-263 SMD HEAT SIN... |
5,000
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK D2PAK TO... |
5,000
In-stock
|
Get Quote | ||
|
|
Ohmite | TO-268 HEAT SINK /P... |
5,000
In-stock
|
Get Quote | ||
|
|
Ohmite | TO-268 SMD HEAT SIN... |
5,000
In-stock
|
Get Quote | ||
|
|
Ohmite | TO-263 SMD HEAT SIN... |
5,000
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK D2PAK TO... |
5,000
In-stock
|
Get Quote | ||
|
|
Ohmite | TO-268 HEAT SINK /P... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-252 CO... |
5,000
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | BOARD LEVEL HEAT... |
5,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
5,000
In-stock
|
Get Quote | ||
|
|
Assmann WSW Components | HEATSINK TO-263 12.7... |
287
In-stock
|
Get Quote | ||
|
|
Ohmite | TO-263 HEAT SINK / P... |
250
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | TO-268 HEAT SINK AN... |
750
In-stock
|
Get Quote | ||
|
|
Aavid | HEATSINK D-PAK3 T... |
5,500
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
9,400
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | TO-263 HEAT SINK AN... |
1,250
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1,000
In-stock
|
Get Quote |
