- Manufacturer:
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- CUI Devices (2)
- Material:
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- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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6 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
![]() |
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
Get Quote | ||
![]() |
Assmann WSW Components | HEATSINK ANOD AL... |
583
In-stock
|
Get Quote | ||
![]() |
Assmann WSW Components | HEATSINK ALUM AN... |
755
In-stock
|
Get Quote | ||
![]() |
Assmann WSW Components | HEATSINK ALUM AN... |
420
In-stock
|
Get Quote | ||
![]() |
CUI Devices | HEAT SINK, EXTRUS... |
794
In-stock
|
Get Quote | ||
![]() |
Assmann WSW Components | HEATSINK ALUM AN... |
7,556
In-stock
|
Get Quote |