- Manufacturer：
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- CUI Devices (2)
- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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11 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X12.5M... |
5,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25... |
979
In-stock
|
Get Quote | ||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1,827
In-stock
|
Get Quote | ||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1,883
In-stock
|
Get Quote | ||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1,735
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,352
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
96
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
80
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25... |
66
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
293
In-stock
|
Get Quote | ||
|
|
Assmann WSW Components | HEATSINK TO-220/TO... |
1,241
In-stock
|
Get Quote |
