- Series：
-
- Material：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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11 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Wakefield-Vette | HEATSINK 128PQFP C... |
5,000
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | HEATSINK 128PQFP C... |
5,000
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | HEATSINK 128PQFP C... |
5,000
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | HEATSINK 128PQFP C... |
5,000
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | HEATSINK 100PQFP C... |
5,000
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | HEATSINK 100PQFP C... |
5,000
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | HEATSINK 100PQFP C... |
5,000
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | HEATSINK 100PQFP C... |
5,000
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | HEATSINK 128PQFP C... |
46
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | HEATSINK CPU 43MM... |
388
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | HEATSINK 100PQFP C... |
2,528
In-stock
|
Get Quote |
