Package Cooled:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Stock Action
401A Wakefield-Vette
HEATSINK POWER T...
RFQ
83
In-stock
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HS03 Apex Microtechnology
HEATSINK 8P TO-3 1....
RFQ
2
In-stock
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401K Wakefield-Vette
HEATSINK POWER N...
RFQ
1
In-stock
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