Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Stock Action
HS29 Apex Microtechnology
HEATSINK 12P TO220 ...
RFQ
5,000
In-stock
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HSS-B20-053H-01 CUI Devices
HEATSINK TO-220 4.8W...
RFQ
1,405
In-stock
Get Quote
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