Series:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Material Finish:
Image Part Manufacturer Description Stock Action
HSS-B20-NP-02 CUI Devices
HEATSINK TO-220 3.6W...
RFQ
5,000
In-stock
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TG-CJ-12-12-10-PF t-Global Technology
HEATSINK CER 12X12...
RFQ
517
In-stock
Get Quote
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