- Manufacturer:
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- CUI Devices (1)
- Material:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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2 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
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CUI Devices | HEATSINK TO-220 3.6W... |
5,000
In-stock
|
Get Quote | ||
![]() |
t-Global Technology | HEATSINK CER 12X12... |
517
In-stock
|
Get Quote |