- Manufacturer：
-
- CUI Devices (4)
- Ohmite (6)
- Length：
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- Width：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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10 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM EXTRUSI... |
12
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM EXTRUSI... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
51
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM EXTRUSI... |
12
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM EXTRUSI... |
14
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM EXTRUSI... |
15
In-stock
|
Get Quote | ||
|
|
Ohmite | ALUMINUM EXTRUSI... |
10
In-stock
|
Get Quote |
