- Manufacturer：
-
- Aavid (21)
- Comair Rotron (2)
- CUI Devices (2)
- DFRobot (1)
- Wakefield-Vette (14)
- Series：
-
- Part Status：
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- Packaging：
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- Length：
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- Width：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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61 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Aavid | COPPER HEATSINK ... |
5,000
In-stock
|
Get Quote | ||
|
|
Aavid | COPPER HEATSINK ... |
5,000
In-stock
|
Get Quote | ||
|
|
Aavid | COPPER HEATSINK ... |
5,000
In-stock
|
Get Quote | ||
|
|
Aavid | COPPER HEATSINK ... |
5,000
In-stock
|
Get Quote | ||
|
|
Aavid | COPPER HEATSINK ... |
5,000
In-stock
|
Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 26... |
5,000
In-stock
|
Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 22... |
5,000
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | HEATSINK DPAK SM... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
5,000
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | HEATSINK ALUM NA... |
5,000
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | HEATSINK ALUM BL... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-252 CO... |
5,000
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | BOARD LEVEL HEAT... |
5,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
219
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
219
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
5,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-252 D-P... |
559
In-stock
|
Get Quote | ||
|
|
Assmann WSW Components | HEATSINK TO-263 12.7... |
287
In-stock
|
Get Quote | ||
|
|
Assmann WSW Components | HEATSINK TO-263 12.7... |
287
In-stock
|
Get Quote |
