- Manufacturer：
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- CUI Devices (3)
- Wakefield-Vette (2)
- Part Status：
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- Material：
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- Packaging：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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5 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Wakefield-Vette | HEATSINK TO-220 VE... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
879
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
879
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
750
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | HEATSINK TO-220 VR... |
1,971
In-stock
|
Get Quote |
