- Manufacturer:
-
- Comair Rotron (1)
- CUI Devices (3)
- Part Status:
-
- Packaging:
-
- Attachment Method:
-
- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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4 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
![]() |
Comair Rotron | HEATSINK STAMP 19... |
5,000
In-stock
|
Get Quote | ||
![]() |
CUI Devices | HEAT SINK TO-263 CO... |
879
In-stock
|
Get Quote | ||
![]() |
CUI Devices | HEAT SINK TO-263 CO... |
879
In-stock
|
Get Quote | ||
![]() |
CUI Devices | HEAT SINK TO-263 CO... |
750
In-stock
|
Get Quote |