- Manufacturer：
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- CUI Devices (1)
- Wakefield-Vette (4)
- Series：
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- Material：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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10 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CTS Electronic Components | FAN AXIAL 34.6X19.8M... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
Get Quote | ||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
5,000
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | ANCHOR HEATSINK ... |
945
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | ANCHOR HEATSINK ... |
120
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | ANCHOR HEATSINK ... |
193
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | ANCHOR HEATSINK ... |
900
In-stock
|
Get Quote | ||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
37
In-stock
|
Get Quote | ||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
2,517
In-stock
|
Get Quote | ||
|
|
CTS Electronic Components | FAN AXIAL 34.6X26.6M... |
306
In-stock
|
Get Quote |
