Manufacturer:
Material:
Package Cooled:
Attachment Method:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Material Finish:
Image Part Manufacturer Description Stock Action
575300B00000G Aavid
BOARD LEVEL HEAT...
RFQ
5,000
In-stock
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HS24 Apex Microtechnology
HEATSINK SMT
RFQ
86
In-stock
Get Quote
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