- Manufacturer：
-
- Comair Rotron (1)
- CUI Devices (1)
- Wakefield-Vette (3)
- Material：
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- Length：
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- Width：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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8 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK STAMP 19... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK HALF BR... |
5,000
In-stock
|
Get Quote | ||
|
|
ABB Embedded Power | HEATSINK 2.27L X.45"... |
5,000
In-stock
|
Get Quote | ||
|
|
ABB Embedded Power | HEATSINK 2.39L X.45"... |
5,000
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | HEATSINK BXB50,75,1... |
5,000
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
5,000
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
5,000
In-stock
|
Get Quote | ||
|
|
CTS Electronic Components | CLIP W/LOCK FOR H... |
5,000
In-stock
|
Get Quote |
