Material:
Package Cooled:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Material Finish:
Image Part Manufacturer Description Stock Action
ATS-PCB1067 Advanced Thermal Solutions, Inc.
HEATSINK TO-220 W/T...
RFQ
5,000
In-stock
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832700T00000 Comair Rotron
HEATSINK STAMP 26...
RFQ
5,000
In-stock
Get Quote
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