- Manufacturer：
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- Comair Rotron (1)
- CUI Devices (1)
- Part Status：
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- Material：
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- Shape：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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8 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BL... |
5,000
In-stock
|
Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 20... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
5,000
In-stock
|
Get Quote | ||
|
|
t-Global Technology | XL25 CERAMIC 20X20M... |
229
In-stock
|
Get Quote | ||
|
|
t-Global Technology | XL25 CERAMIC 20X20M... |
885
In-stock
|
Get Quote | ||
|
|
t-Global Technology | HEATSINK CER 20X20... |
1,384
In-stock
|
Get Quote | ||
|
|
t-Global Technology | HEATSINK CER 20X20... |
2,545
In-stock
|
Get Quote | ||
|
|
t-Global Technology | XL25 CERAMIC BOAR... |
3,304
In-stock
|
Get Quote |
