Series:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Stock Action
HSE-B20500-040H-01 CUI Devices
HEAT SINK, EXTRUS...
RFQ
5,000
In-stock
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V8813Y Assmann WSW Components
HEATSINK TO-220/TO...
RFQ
2,074
In-stock
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