- Manufacturer：
-
- CUI Devices (3)
- Ohmite (2)
- Material：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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5 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
100
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
183
In-stock
|
Get Quote |
