Manufacturer:
Material:
Package Cooled:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Stock Action
DA-T268-101E Ohmite
HEATSINK FOR TO-2...
RFQ
1
In-stock
Get Quote
DV-T268-101E Ohmite
HEATSINK FOR TO-2...
RFQ
1
In-stock
Get Quote
DA-T268-101E-TR Ohmite
TO-268 HEAT SINK /P...
RFQ
5,000
In-stock
Get Quote
DV-T268-101E-TR Ohmite
TO-268 HEAT SINK /P...
RFQ
5,000
In-stock
Get Quote
HS24 Apex Microtechnology
HEATSINK SMT
RFQ
86
In-stock
Get Quote
1 / 1 Page, 5 Records