Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Stock Action
HS02 Apex Microtechnology
HEATSINK 8P TO-3 4....
RFQ
21
In-stock
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HS18 Apex Microtechnology
HEATSINK 12P DIP
RFQ
22
In-stock
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