Package Cooled:
Attachment Method:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Stock Action
HS28 Apex Microtechnology
HEATSINK SIP
RFQ
5,000
In-stock
Get Quote
HS21 Apex Microtechnology
HEATSINK 6P DIP
RFQ
5,000
In-stock
Get Quote
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