Package Cooled:
Attachment Method:
Height Off Base (Height of Fin):
Thermal Resistance @ Natural:
Image Part Manufacturer Description Stock Action
HS11 Apex Microtechnology
HEATSINK 2TO-3 & 12P...
RFQ
5,000
In-stock
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HS32 Apex Microtechnology
HEATSINK SIP 1.33C...
RFQ
7
In-stock
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