- Manufacturer：
-
- Aavid (25)
- Comair Rotron (3)
- CUI Devices (8)
- Ohmite (3)
- Wakefield-Vette (6)
- Series：
-
- Part Status：
-
- Material：
-
- Width：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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55 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | HEATSINK TO-220 VE... |
5,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | HEATSINK TO-220 VE... |
5,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
Get Quote | ||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
5,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
86
In-stock
|
Get Quote | ||
|
|
t-Global Technology | PH3N NANO 50.8X12.07X... |
129
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK TO-218,TO... |
725
In-stock
|
Get Quote | ||
|
|
Aavid | HEATSINK TO-220 W/T... |
5,695
In-stock
|
Get Quote | ||
|
|
Aavid | HEATSINK TO-220 SO... |
1,120
In-stock
|
Get Quote |
