- Manufacturer：
-
- Aavid (9)
- CUI Devices (12)
- Ohmite (24)
- Wakefield-Vette (14)
- Material：
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- Width：
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- Diameter：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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68 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Ohmite | TO-268 SMD HEAT SIN... |
5,000
In-stock
|
Get Quote | ||
|
|
Ohmite | TO-263 SMD HEAT SIN... |
5,000
In-stock
|
Get Quote | ||
|
|
Ohmite | TO-268 HEAT SINK /P... |
5,000
In-stock
|
Get Quote | ||
|
|
Ohmite | TO-268 SMD HEAT SIN... |
5,000
In-stock
|
Get Quote | ||
|
|
Ohmite | TO-263 SMD HEAT SIN... |
5,000
In-stock
|
Get Quote | ||
|
|
Ohmite | TO-268 HEAT SINK /P... |
5,000
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | HEATSINK TO-220 W/S... |
5,000
In-stock
|
Get Quote | ||
|
|
Aavid | HEATSINK TO-5 .5" B... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4W ... |
5,000
In-stock
|
Get Quote | ||
|
|
Wakefield-Vette | HEATSINK ALUM NA... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.3W... |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 3.2W... |
5,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
219
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
219
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
5,000
In-stock
|
Get Quote | ||
|
|
Assmann WSW Components | HEATSINK TO-263 12.7... |
287
In-stock
|
Get Quote | ||
|
|
Assmann WSW Components | HEATSINK TO-263 12.7... |
287
In-stock
|
Get Quote | ||
|
|
Assmann WSW Components | HEATSINK TO-263 12.7... |
287
In-stock
|
Get Quote | ||
|
|
Ohmite | TO-263 HEAT SINK / P... |
367
In-stock
|
Get Quote | ||
|
|
Ohmite | TO-263 HEAT SINK / P... |
367
In-stock
|
Get Quote |
